JPH025903U - - Google Patents
Info
- Publication number
- JPH025903U JPH025903U JP8353188U JP8353188U JPH025903U JP H025903 U JPH025903 U JP H025903U JP 8353188 U JP8353188 U JP 8353188U JP 8353188 U JP8353188 U JP 8353188U JP H025903 U JPH025903 U JP H025903U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- microwave
- metal carrier
- microwave semiconductor
- dielectric substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8353188U JPH025903U (en]) | 1988-06-23 | 1988-06-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8353188U JPH025903U (en]) | 1988-06-23 | 1988-06-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH025903U true JPH025903U (en]) | 1990-01-16 |
Family
ID=31308244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8353188U Pending JPH025903U (en]) | 1988-06-23 | 1988-06-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH025903U (en]) |
-
1988
- 1988-06-23 JP JP8353188U patent/JPH025903U/ja active Pending